A fannin duba wafer na semiconductor, tsarkin muhallin tsafta yana da alaƙa kai tsaye da yawan amfanin samfurin. Yayin da daidaiton hanyoyin kera guntu ke ci gaba da inganta, buƙatun kayan aikin gano abubuwa suna ƙara zama masu tsauri. Dandalin granite, tare da halayensu na sakin ion na ƙarfe mara ƙarfe da ƙarancin gurɓataccen barbashi, sun zarce kayan ƙarfe na gargajiya kuma sun zama mafita mafi kyau ga kayan aikin duba wafer.
Granite dutse ne na halitta wanda galibi ya ƙunshi ma'adanai marasa ƙarfe kamar quartz, feldspar da mica. Wannan halayyar tana ba shi fa'idar sakin ion na ƙarfe ba tare da ƙarfe ba. Sabanin haka, bakin ƙarfe, a matsayin ƙarfe na ƙarfe kamar ƙarfe, chromium da nickel, yana da saurin lalata lantarki a saman sa saboda zaizayar tururin ruwa da iskar gas mai guba ko alkaline a cikin muhallin ɗaki mai tsafta, wanda ke haifar da hazo na ions na ƙarfe kamar Fe²⁺ da Cr³⁺. Da zarar waɗannan ƙananan ions sun haɗu da saman wafer, za su canza halayen lantarki na kayan semiconductor a cikin ayyuka masu zuwa kamar photolithography da etching, suna haifar da raguwar ƙarfin lantarki na transistor, har ma suna haifar da gajerun da'irori a cikin da'irar. Bayanan gwajin ƙwararru na cibiyoyi sun nuna cewa bayan da aka ci gaba da fallasa dandamalin granite ga yanayin zafin ɗaki mai tsabta da danshi (23±0.5℃, 45%±5% RH) na tsawon awanni 1000, sakin ions na ƙarfe ya yi ƙasa da iyakar ganowa (< 0.1ppb). Yawan lahani na wafers da gurɓataccen ion na ƙarfe ke haifarwa lokacin amfani da dandamalin ƙarfe na bakin ƙarfe na iya kaiwa kashi 15% zuwa 20%.
Dangane da kula da gurɓatar ƙwayoyin cuta, dandamalin granite suma suna aiki sosai. Dakunan tsaftacewa suna da matuƙar buƙata don yawan ƙwayoyin da aka dakatar a cikin iska. Misali, a cikin ɗakunan tsaftacewa na ISO Class 1, adadin ƙwayoyin cuta 0.1μm da aka yarda a kowace mita mai siffar cubic bai wuce 10 ba. Ko da an yi amfani da dandamalin ƙarfe mai bakin ƙarfe wajen gogewa, har yanzu yana iya haifar da tarkacen ƙarfe ko sikelin oxide da ke barewa saboda ƙarfin waje kamar girgizar kayan aiki da aikin ma'aikata, wanda zai iya tsoma baki ga hanyar gani ko kuma ya karce saman wafer ɗin. Dandalin granite, tare da tsarin ma'adinai mai yawa (yawan ≥2.7g/cm³) da tauri mai yawa (6-7 akan sikelin Mohs), ba sa fuskantar lalacewa ko karyewa yayin amfani na dogon lokaci. Ma'aunin da aka auna ya nuna cewa suna iya rage yawan ƙwayoyin da aka dakatar a cikin iskar yankin kayan aikin ganowa da fiye da 40% idan aka kwatanta da dandamalin ƙarfe mai bakin ƙarfe, yana kiyaye ƙa'idodin matakin ɗakin tsaftacewa yadda ya kamata.
Baya ga tsabtar halayensa, cikakken aikin dandamalin dutse ya fi na bakin karfe nesa ba kusa ba. Dangane da kwanciyar hankali na zafi, yawan faɗaɗa zafinsa (4-8) ×10⁻⁶/℃), ƙasa da rabin ƙarfe mai bakin karfe (kimanin 17×10⁻⁶/℃), wanda zai iya kiyaye daidaiton wurin da kayan aikin ganowa ke kasancewa lokacin da zafin jiki a cikin ɗakin tsabta ya canza. Babban halayen damfara (rabo mai damfara > 0.05) na iya rage girgizar kayan aikin cikin sauri kuma ya hana binciken ganowa girgiza. Juriyar tsatsa ta halitta tana ba shi damar kasancewa cikin kwanciyar hankali ko da lokacin da aka fallasa shi ga sinadarai masu hana hasken photoresist, iskar gas mai ƙonewa da sauran sinadarai ba tare da buƙatar ƙarin kariya daga rufi ba.
A halin yanzu, ana amfani da dandamalin granite sosai a masana'antun kera wafer na zamani. Bayanai sun nuna cewa bayan amfani da dandamalin granite, ƙimar fahimtar kuskuren gano barbashi a saman wafer ya ragu da kashi 60%, an tsawaita zagayowar daidaita kayan aiki sau uku, kuma jimlar farashin samarwa ya ragu da kashi 25%. Yayin da masana'antar semiconductor ke ci gaba zuwa ga daidaito mafi girma, dandamalin granite, tare da manyan fa'idodin su kamar sakin ion na ƙarfe mara sifili da ƙarancin gurɓataccen barbashi, za su ci gaba da samar da tallafi mai ɗorewa da aminci ga duba wafer, wanda hakan zai zama muhimmin ƙarfi da ke haifar da ci gaban masana'antar.
Lokacin Saƙo: Mayu-20-2025