Zhongyan Evonik Laser alama inji
Matsayi mai madaidaici: Yana ɗaukar tushe mai dutse biyu na marmara da granite, tare da ƙimar haɓakar zafin jiki kusan sifili da madaidaiciyar bugun jini na ± 5μm. Haɗe tare da tsarin grating Renishaw da direban Gaocun, an sami 0.5μm-matakin rufaffiyar madauki, tare da kuskuren taswirar taswira na ± 1.5μm. Wannan zai iya kawar da matsalar "layin layi", saduwa da ƙananan matakan ƙananan ƙananan buƙatun a cikin samar da baturi na perovskite. Yana da kyau ya nisanci kashe layin layi wanda ke haifar da nakasar dandamali kuma yana tabbatar da ingancin canjin hoto na baturi.
Babban kwanciyar hankali: Granite yana da halayen juriya ga canjin zafin jiki da lalata. Ayyukansa baya raguwa a cikin kewayon zafin jiki mai faɗi daga -20 ℃ zuwa 50 ℃. Tsayayyen tsarin da ya ƙunshi shi da marmara, haɗe da jakunkuna masu ɗaukar girgiza, yana da ƙimar ƙarar girgiza sama da 90%, kuma girman girgiza kayan aikin kanta bai wuce 0.1μm ba. An inganta daidaiton alamar da kashi 40%, wanda zai iya dacewa da yanayin yanayi mai tsanani kamar tarurrukan da ba su da ƙura da kuma yanayin zafi mai zafi. Yana tabbatar da cewa shugaban laser ba ya girgiza yayin motsi mai sauri, kuma alamar alamar yana da santsi ba tare da burrs ba, wanda ke taimakawa wajen inganta yawan samfurin.
Babban aiki mai sauri: Fasahar tuƙi ta linzamin linzamin kwamfuta tare da tushe mai tushe da sauran ƙira, haɓakawa na iya tashi zuwa 1.6G, kuma yana iya motsawa cikin babban saurin 1000mm/s. Ko da a ƙarƙashin nauyin 750kg, har yanzu yana iya kula da kwanciyar hankali na sauri na 1%, goyon bayan 7 × 24-hour ci gaba da samar da kayan aiki, ƙaddamar da sake zagayowar kulawa fiye da sau uku, rage rage farashin lokaci, da kuma inganta ingantaccen samarwa.
ROFIN Laser aiki tsarin
Babban aiki mai inganci: A cikin sarrafa Laser na sel na PERC, dandamali na tsarin yana da bel na jigilar kaya guda biyu masu zaman kansu don jigilar wafers, kowanne sanye take da Laser. Jigon na'ura yana ɗaukar tushe mai madaidaicin granite don tallafawa saurin watsa tushen laser da wafers. Ta hanyar fasahar "sarrafa jirgin", lokacin watsa wafer na siliki da canja wuri a cikin tsarin sarrafa Laser ya ragu sosai. Gudun sarrafawa zai iya kaiwa guda 4,500 a kowace awa, yana haɓaka haɓakar samarwa sosai.
High-daidaici aiki Saboda yin amfani da dutse sansanonin, da kwanciyar hankali da kuma high madaidaicin Laser tushen da wafer watsa suna da garanti, kunna Laser aiki saduwa daban-daban high-daidaici aiki da bukatun a PERC baturi samar, kamar m line, dashed line, batu-line aiki, kazalika da zabi emitter, MWT hakowa da gefen rufi matakai, duk tare da high preci za a iya aiwatar a kan dandamali.
Daga sama lokuta, ana iya gani cewa dutse sansanonin da mahara abũbuwan amfãni a baturi samar Lines, ciki har da kyau kwarai thermal kwanciyar hankali, high rigidity da seismic juriya, high-daidaici riƙewa, da kuma mai kyau lalata juriya, da dai sauransu Wadannan abũbuwan amfãni taimaka wajen inganta yadda ya dace, inganci da daidaito na baturi samar, rage samar da kuma kula da halin kaka, da kuma haka inganta ci gaban da baturi masana'antu.
Lokacin aikawa: Mayu-15-2025