A cikin madaidaicin tsarin masana'antar semiconductor na marufi na wafer, damuwa na thermal yana kama da "masu hallaka" da ke ɓoye a cikin duhu, koyaushe yana barazanar ingancin marufi da aikin kwakwalwan kwamfuta. Daga bambance-bambance a cikin haɓakar haɓakar haɓakar thermal tsakanin kwakwalwan kwamfuta da kayan tattarawa zuwa sauye-sauyen zafin jiki mai tsauri yayin aiwatar da marufi, hanyoyin tsararrun matsalolin zafi sun bambanta, amma duk suna nuna sakamakon rage yawan amfanin ƙasa da kuma shafar amincin dogon lokaci na kwakwalwan kwamfuta. Tushen granite, tare da kaddarorin kayan sa na musamman, cikin nutsuwa yana zama “mataimaki” mai ƙarfi wajen magance matsalar matsananciyar zafi.
Matsalolin damuwa na thermal a cikin marufi na wafer
Fakitin Wafer ya ƙunshi aikin haɗin gwiwa na abubuwa da yawa. Chips yawanci sun haɗa da kayan semiconductor kamar silicon, yayin da kayan marufi kamar kayan marufi na filastik da kayan maye sun bambanta da inganci. Lokacin da zafin jiki ya canza yayin aiwatar da marufi, kayan daban-daban sun bambanta sosai a cikin ƙimar haɓakawar thermal da ƙanƙancewa saboda bambance-bambance masu yawa a cikin haɓakar haɓakar thermal (CTE). Misali, ƙididdigewa na haɓakar haɓakar kwakwalwan siliki na thermal shine kusan 2.6 × 10⁻⁶ / ℃, yayin da ƙimar haɓakar haɓakar haɓakar kayan haɓakar resin epoxy na gama gari ya kai 15-20 × 10⁻⁻ / ℃. Wannan babban gibin yana haifar da raguwar digiri na guntu da kayan marufi su zama asynchronous yayin matakin sanyaya bayan marufi, yana haifar da matsananciyar zafi a mu'amala tsakanin su biyun. Ƙarƙashin ci gaba da tasirin zafin zafi, wafer na iya jujjuyawa kuma ya lalace. A cikin lokuta masu tsanani, yana iya haifar da lahani mai kisa kamar guntu tsattsauran ra'ayi, karyewar haɗin gwiwa, da ɓata lokaci, yana haifar da lalacewa ga aikin guntu da raguwa mai yawa a cikin rayuwar sabis. Dangane da kididdigar masana'antu, ƙarancin marufi na wafer da ke haifar da al'amuran damuwa na thermal na iya zama sama da 10% zuwa 15%, zama babban abin da ke hana ingantaccen ingantaccen haɓaka masana'antar semiconductor.
Halayen abũbuwan amfãni na granite tushe
Low coefficient na thermal fadada: Granite yafi hada da ma'adinai lu'ulu'u kamar ma'adini da feldspar, da kuma coefficient na thermal fadada shi ne musamman low, kullum jere daga 0.6 to 5×10⁻⁶/℃, wanda shi ne kusa da na silicon kwakwalwan kwamfuta. Wannan halayyar yana ba da damar cewa yayin aiki na kayan aikin wafer, ko da lokacin da ake fuskantar canjin yanayin zafi, bambancin haɓakar thermal tsakanin granite tushe da guntu da kayan marufi ya ragu sosai. Misali, lokacin da zafin jiki ya canza da 10 ℃, girman bambancin dandali na marufi da aka gina akan granite tushe za a iya rage shi da fiye da 80% idan aka kwatanta da na gargajiya karfe tushe, wanda ƙwarai rage thermal danniya lalacewa ta hanyar asynchronous thermal fadada da contraction, da kuma samar da mafi m goyon baya yanayi ga wafer.
Kyakkyawan kwanciyar hankali na thermal: Granite yana da ingantaccen kwanciyar hankali na thermal. Tsarinsa na ciki yana da yawa, kuma lu'ulu'u suna da alaƙa da juna ta hanyar haɗin gwiwar ionic da covalent, suna ba da damar jinkirin tafiyar da zafi a ciki. Lokacin da kayan aikin marufi ke jure yanayin yanayin zafi mai rikitarwa, tushen granite zai iya danne tasirin canjin zafin jiki yadda ya kamata kuma ya kula da filin zafin jiki mai tsayi. Gwaje-gwajen da suka dace sun nuna cewa a ƙarƙashin canjin canjin yanayi na yau da kullun na kayan marufi (kamar ± 5 ℃ a cikin minti daya), ana iya sarrafa daidaituwar yanayin yanayin zafin jiki na tushen granite a cikin ± 0.1 ℃, guje wa sabon yanayin damuwa na thermal wanda ya haifar da bambance-bambancen zazzabi na gida, tabbatar da cewa wafer yana cikin tsari da kwanciyar hankali na yanayin yanayin zafi, da rage yawan yanayin yanayin zafi da damuwa.
Babban ƙarfi da damping vibration: A lokacin aiki na wafer marufi kayan aiki, da inji motsi sassa a ciki (kamar motors, watsa na'urorin, da dai sauransu) za su haifar da vibration. Idan ana watsa waɗannan girgizar zuwa ga wafer, za su ƙara lalacewa da damuwa ta zafi ga wafer. Tushen Granite suna da tsayin daka da ƙarfi sama da na kayan ƙarfe da yawa, waɗanda zasu iya tsayayya da tsangwama na girgizar waje yadda ya kamata. A halin yanzu, tsarinsa na musamman na ciki yana ba shi kyakkyawan aikin damping na girgiza kuma yana ba shi damar watsar da kuzarin girgiza cikin sauri. Bayanan bincike sun nuna cewa tushe na granite zai iya rage yawan girgiza mai girma (100-1000Hz) da aka samar ta hanyar aiki na kayan aiki ta hanyar 60% zuwa 80%, da muhimmanci rage tasirin haɗuwa na girgizawa da damuwa na thermal, da kuma kara tabbatar da madaidaicin madaidaici da babban amincin marufi na wafer.
Tasirin aikace-aikacen aikace-aikace
A cikin layin samar da marufi na wafer na sananniyar masana'antar masana'anta ta semiconductor, bayan gabatar da kayan aikin marufi tare da sansanonin granite, an sami nasarori masu ban mamaki. Dangane da nazarin bayanan bincike na wafers 10,000 bayan fakitin, kafin ɗaukar tushe na granite, ƙarancin ƙarancin wafer warping wanda ya haifar da damuwa ta thermal shine 12%. Koyaya, bayan canzawa zuwa tushen granite, ƙarancin lahani ya ragu sosai zuwa cikin 3%, kuma yawan amfanin ƙasa ya inganta sosai. Bugu da ƙari kuma, dogon lokaci AMINCI gwaje-gwaje sun nuna cewa bayan 1,000 hawan keke na high zafin jiki (125 ℃) da kuma low zazzabi (-55 ℃), yawan solder hadin gwiwa kasawa na guntu dangane da granite tushe kunshin da aka rage da 70% idan aka kwatanta da gargajiya tushe kunshin, da kuma yi kwanciyar hankali na guntu da aka ƙwarai inganta.
Kamar yadda fasahar semiconductor ke ci gaba da ci gaba zuwa mafi girman daidaito da ƙarami, buƙatun don sarrafa damuwa na zafi a cikin marufi na wafer suna ƙara tsauri. Tushen Granite, tare da cikakkun fa'idodin su a cikin ƙarancin haɓaka haɓakar haɓakar thermal, kwanciyar hankali na thermal da raguwar girgiza, sun zama babban zaɓi don haɓaka ingancin fakitin wafer da rage tasirin damuwa mai zafi. Suna taka muhimmiyar rawa wajen tabbatar da dorewar ci gaban masana'antar semiconductor.
Lokacin aikawa: Mayu-15-2025