1. Daidaiton girman girman
Flatness: lebur na saman tushe ya kamata ya kai matsayi mai girma, kuma kuskuren kuskuren kada ya wuce ± 0.5μm a kowane yanki na 100mm × 100mm; Ga dukkan jirgin tushe, ana sarrafa kuskuren flatness a cikin ± 1μm. Wannan yana tabbatar da cewa mahimman abubuwan da ke cikin kayan aikin semiconductor, kamar babban shugaban kayan aikin lithography da teburin bincike na kayan gano guntu, ana iya shigar da su da ƙarfi kuma a sarrafa su a kan babban madaidaicin jirgin sama, tabbatar da daidaiton hanyar gani da haɗin da'ira na kayan, da kuma guje wa karkatar da matsuguni na abubuwan da ke haifar da rashin daidaituwa jirgin sama na tushe, wanda ke shafar daidaiton guntu da gano guntu.
Madaidaici: Madaidaicin kowane gefen tushe yana da mahimmanci. A cikin jagorancin tsayi, kuskuren madaidaiciya ba zai wuce ± 1μm da 1m ba; Ana sarrafa kuskuren madaidaiciyar diagonal a cikin ± 1.5μm. Ɗaukar ingantacciyar ingin lithography a matsayin misali, lokacin da tebur ke motsawa tare da layin jagora na tushe, madaidaiciyar gefen tushe kai tsaye yana rinjayar daidaiton yanayin tebur. Idan madaidaiciyar ba ta kai ga ma'auni ba, tsarin lithography zai zama gurɓatacce kuma ya lalace, yana haifar da raguwar yawan amfanin guntu.
Daidaituwa: Kuskuren daidaitawa na sama da ƙananan saman tushe yakamata a sarrafa su a cikin ± 1μm. Kyakkyawan daidaitawa zai iya tabbatar da kwanciyar hankali na gaba ɗaya cibiyar nauyi bayan shigar da kayan aiki, kuma ƙarfin kowane bangare ya kasance daidai. A semiconductor wafer masana'antu kayan aiki, idan babba da ƙananan saman na tushe ba a layi daya ba, da wafer zai karkata a lokacin aiki, rinjayar da tsari uniformity kamar etching da shafi, kuma ta haka rinjayar guntu yi daidaito.
Na biyu, halaye na kayan abu
Taurin: Taurin kayan tushe ya kamata ya kai ga taurin Shore HS70 ko sama. Babban taurin zai iya tsayayya da lalacewa ta hanyar motsawa akai-akai da rikice-rikice na abubuwan da aka gyara yayin aikin kayan aiki, tabbatar da cewa tushe na iya kula da girman madaidaici bayan amfani da dogon lokaci. A cikin na'urorin tattara guntu, hannun mutum-mutumi yana yawan kamawa da sanya guntu akan tushe, kuma babban taurin gindin na iya tabbatar da cewa saman ba shi da sauƙi don samar da karce da kiyaye daidaiton motsin hannun mutum-mutumi.
Yawa: Yawan kayan ya kamata ya kasance tsakanin 2.6-3.1 g/cm³. Matsakaicin da ya dace ya sa tushe ya sami kwanciyar hankali mai kyau, wanda zai iya tabbatar da isasshen ƙarfi don tallafawa kayan aiki, kuma ba zai kawo matsaloli ga shigarwa da sufuri na kayan aiki ba saboda nauyin nauyi. A cikin manyan kayan aikin duba semiconductor, ƙaƙƙarfan tushe mai ƙarfi yana taimakawa don rage watsawar girgiza yayin aikin kayan aiki da haɓaka daidaiton ganowa.
Ƙarfafawar thermal: ƙimar haɓakar haɓakar layin layi bai wuce 5×10⁻⁶/℃. Kayan aikin Semiconductor yana da matukar damuwa ga canje-canjen zafin jiki, kuma kwanciyar hankali na thermal na tushe yana da alaƙa kai tsaye da daidaiton kayan aiki. A lokacin aikin lithography, canjin zafin jiki na iya haifar da faɗaɗawa ko ƙaddamarwa na tushe, wanda ya haifar da ɓata girman girman yanayin bayyanar. Tushen granite tare da ƙarancin faɗaɗa faɗaɗa na layi na iya sarrafa canjin girman a cikin ƙaramin ƙaramin kewayon lokacin da zafin jiki na kayan aiki ya canza (gaba ɗaya 20-30 ° C) don tabbatar da daidaiton lithography.
Na uku, ingancin saman
Roughness: Ƙimar saman Ra akan tushe baya wuce 0.05μm. Ƙarƙashin ƙwanƙwasa mai laushi zai iya rage tallan ƙura da ƙazanta da kuma rage tasiri a kan tsabtar yanayin masana'antar guntu na semiconductor. A cikin bitar da ba ta da kura ta masana'antar guntu, ƙananan barbashi na iya haifar da lahani kamar gajeriyar da'ira na guntu, kuma santsin saman tushe yana taimakawa wajen kula da tsaftataccen muhalli na bitar da haɓaka yawan guntu.
Lalacewar da ba a iya gani ba: Ba a yarda saman tushe ya sami fashewar gani, ramukan yashi, pores da sauran lahani. A matakin ƙananan ƙananan, adadin lahani tare da diamita fiye da 1μm a kowace centimita murabba'i ba zai wuce 3 ta microscopy na lantarki ba. Wadannan lahani za su shafi ƙarfin tsarin da kuma shimfidar wuri na tushe, sa'an nan kuma rinjayar kwanciyar hankali da daidaito na kayan aiki.
Na hudu, kwanciyar hankali da juriya
Kwanciyar kwanciyar hankali: A cikin yanayin girgizar da aka kwaikwayi wanda aka samar ta hanyar aiki na kayan aikin semiconductor (yawan mitar girgizawa 10-1000Hz, amplitude 0.01-0.1mm), girgizar girgizar mahimman abubuwan hawa kan tushe ya kamata a sarrafa a cikin ± 0.05μm. Ɗaukar kayan gwajin semiconductor a matsayin misali, idan girgizar na'urar ta kanta da girgizar muhallin da ke kewaye da ita ana watsa su zuwa tushe yayin aiki, ana iya tsoma baki da daidaiton siginar gwajin. Kyakkyawan kwanciyar hankali mai ƙarfi na iya tabbatar da ingantaccen sakamakon gwaji.
Juriya na Seismic: Tushen dole ne ya sami kyakkyawan aikin girgizar ƙasa, kuma yana iya saurin rage kuzarin girgiza lokacin da aka sa shi ga girgizar waje kwatsam (kamar girgizar girgizar girgizar ƙasa), kuma tabbatar da cewa matsayin dangi na mahimman abubuwan kayan aikin yana canzawa cikin ± 0.1μm. A cikin masana'antar semiconductor a cikin wuraren da ke da girgizar ƙasa, sansanonin da ke jure girgizar ƙasa na iya kare kayan aikin semiconductor masu tsada yadda yakamata, rage haɗarin lalacewar kayan aiki da rushewar samarwa saboda girgiza.
5. Chemical kwanciyar hankali
Lalacewa juriya: Tushen granite ya kamata ya jure lalata abubuwan da ke tattare da sinadaran gama gari a cikin tsarin masana'antar semiconductor, irin su hydrofluoric acid, aqua regia, da sauransu. Jiƙa a cikin aqua regia (girman adadin hydrochloric acid zuwa nitric acid 3:1) na tsawon sa'o'i 12, kuma babu wasu alamun lalata a saman. Tsarin masana'anta na semiconductor ya ƙunshi nau'ikan etching na sinadarai da hanyoyin tsaftacewa, kuma kyakkyawar juriya mai kyau na tushe na iya tabbatar da cewa amfani da dogon lokaci a cikin yanayin sinadarai ba ta lalace ba, kuma ana kiyaye daidaito da daidaiton tsari.
Anti-ƙasa: The tushe abu yana da musamman low sha na kowa gurbatawa a cikin semiconductor masana'antu yanayi, kamar Organic gas, karfe ions, da dai sauransu Lokacin da aka sanya a cikin wani yanayi dauke da 10 PPM na Organic gas (misali, benzene, toluene) da 1ppm na karfe ions (misali, jan karfe ions, baƙin ƙarfe ions) ga 72 hours, da aikin da aka haifar da pollutant tushe. m. Wannan yana hana gurɓatawa yin ƙaura daga saman ƙasa zuwa yankin masana'anta kuma yana shafar ingancin guntu.
Lokacin aikawa: Maris 28-2025