Bukatun fasaha don tushen granite don kayan aikin semiconductor.

1. Daidaiton girma
Faɗi: Faɗin saman tushe ya kamata ya kai matsayi mai girma, kuma kuskuren faɗin bai kamata ya wuce ±0.5μm a kowane yanki na 100mm × 100mm ba; Ga dukkan saman tushe, ana sarrafa kuskuren faɗin a cikin ±1μm. Wannan yana tabbatar da cewa ana iya shigar da mahimman abubuwan kayan aikin semiconductor, kamar kan fallasa kayan aikin lithography da teburin bincike na kayan aikin gano guntu, a cikin kwanciyar hankali kuma ana iya aiki da su akan babban matakin daidaito, tabbatar da daidaiton hanyar gani da haɗin da'ira na kayan aiki, da kuma guje wa karkacewar abubuwan da suka haifar da rashin daidaituwa na saman tushe, wanda ke shafar kera guntun semiconductor da daidaiton gano guntu.
Daidaito: Daidaito na kowane gefen tushe yana da mahimmanci. A alkiblar tsayi, kuskuren madaidaiciyar ba zai wuce ±1μm a kowace 1m ba; Ana sarrafa kuskuren madaidaiciyar diagonal a cikin ±1.5μm. Idan aka ɗauki injin lithography mai inganci a matsayin misali, lokacin da teburin ke motsawa tare da layin jagora na tushe, madaidaicin gefen tushe yana shafar daidaiton hanyar teburin kai tsaye. Idan madaidaicin bai kai ga daidaito ba, tsarin lithography zai lalace kuma ya lalace, wanda ke haifar da raguwar yawan samar da guntu.
Daidaito: Ya kamata a sarrafa kuskuren daidaitawar saman sama da ƙasa na tushe a cikin ±1μm. Kyakkyawan daidaito na iya tabbatar da daidaiton tsakiyar nauyi gaba ɗaya bayan shigar da kayan aiki, kuma ƙarfin kowane sashi iri ɗaya ne. A cikin kayan aikin kera wafer na semiconductor, idan saman sama da ƙasa na tushe ba su yi daidai ba, wafer ɗin zai karkata yayin sarrafawa, yana shafar daidaiton tsari kamar etching da shafi, kuma don haka yana shafar daidaiton aikin guntu.
Na biyu, halayen kayan abu
Tauri: Tauri na kayan tushe na dutse ya kamata ya kai ga tauri na Shore HS70 ko sama da haka. Babban tauri zai iya jure lalacewa da ke faruwa sakamakon yawan motsi da gogayya na kayan aiki yayin aikin kayan aiki, yana tabbatar da cewa tushe zai iya kiyaye girman daidai bayan amfani na dogon lokaci. A cikin kayan marufi na guntu, hannun robot yakan kama kuma ya sanya guntu a kan tushe, kuma babban tauri na tushe zai iya tabbatar da cewa saman ba shi da sauƙin haifar da karce da kuma kiyaye daidaiton motsin hannun robot.
Yawan abu: Yawan abu ya kamata ya kasance tsakanin 2.6-3.1 g/cm³. Yawan abu mai dacewa yana sa tushen ya sami kwanciyar hankali mai kyau, wanda zai iya tabbatar da isasshen tauri don tallafawa kayan aiki, kuma ba zai kawo wa kayan aiki matsala ba saboda yawan nauyi. A cikin manyan kayan aikin duba semiconductor, yawan tushe mai ƙarfi yana taimakawa wajen rage watsa girgiza yayin aikin kayan aiki da inganta daidaiton ganowa.
Kwanciyar hankali: ma'aunin faɗaɗa layi yana ƙasa da 5×10⁻⁶/℃. Kayan aikin Semiconductor suna da matuƙar saurin kamuwa da canje-canjen zafin jiki, kuma kwanciyar hankali na tushen yana da alaƙa kai tsaye da daidaiton kayan aikin. A lokacin aikin lithography, canjin zafin jiki na iya haifar da faɗaɗa ko matsewar tushe, wanda ke haifar da karkacewa a girman tsarin fallasa. Tushen granite mai ƙarancin ma'aunin faɗaɗa layi na iya sarrafa canjin girman a cikin ƙaramin kewayon lokacin da zafin aiki na kayan aikin ya canza (galibi 20-30 ° C) don tabbatar da daidaiton lithography.
Na uku, ingancin saman
Taushi: Taushi na saman Ra darajar da ke kan tushe ba ta wuce 0.05μm ba. Taushi mai santsi sosai zai iya rage shaƙar ƙura da ƙazanta tare da rage tasirin da ke kan tsaftar muhallin kera guntu na semiconductor. A cikin bitar kera guntu mara ƙura, ƙananan barbashi na iya haifar da lahani kamar gajeriyar da'irar guntu, kuma santsi na tushe yana taimakawa wajen kiyaye muhalli mai tsabta na bitar da kuma inganta yawan guntu.
Lalacewar ƙananan ƙwayoyin cuta: Ba a yarda saman tushen ya kasance yana da wasu fasa, ramukan yashi, ramuka da sauran lahani ba. A matakin ƙananan ƙwayoyin cuta, adadin lahani da diamita ya fi 1μm a kowace murabba'in santimita ba zai wuce 3 ba ta hanyar na'urar auna haske ta lantarki. Waɗannan lahani za su shafi ƙarfin tsarin tushe da kuma faɗin samansa, sannan su shafi daidaito da daidaiton kayan aikin.
Na huɗu, kwanciyar hankali da juriyar girgiza
Kwanciyar hankali: A cikin yanayin girgiza da aka kwaikwayi wanda aikin kayan aikin semiconductor ya samar (mita na girgiza 10-1000Hz, girman 0.01-0.1mm), ya kamata a sarrafa motsin girgiza na mahimman wuraren hawa a kan tushe a cikin ±0.05μm. Idan aka ɗauki kayan aikin gwajin semiconductor a matsayin misali, idan girgizar na'urar da yanayin da ke kewaye da ita suka wuce zuwa tushe yayin aiki, ana iya katse daidaiton siginar gwaji. Kyakkyawan kwanciyar hankali na motsi zai iya tabbatar da ingantaccen sakamakon gwaji.
Juriyar Girgizar Ƙasa: Dole ne tushen ya kasance yana da kyakkyawan aikin girgizar ƙasa, kuma zai iya rage ƙarfin girgizar ƙasa cikin sauri lokacin da aka fuskanci girgizar waje kwatsam (kamar girgizar girgizar ƙasa), kuma ya tabbatar da cewa matsayin muhimman abubuwan da ke cikin kayan aikin ya canza cikin ±0.1μm. A masana'antun semiconductor a yankunan da girgizar ƙasa ke iya faruwa, sansanonin da ke jure girgizar ƙasa na iya kare kayan aikin semiconductor masu tsada yadda ya kamata, wanda ke rage haɗarin lalacewar kayan aiki da katsewar samarwa sakamakon girgizar ƙasa.
5. Daidaiton sinadarai
Juriyar Tsatsa: Tushen granite ya kamata ya jure tsatsa na sinadarai da aka saba amfani da su a cikin tsarin kera semiconductor, kamar su hydrofluoric acid, aqua regia, da sauransu. Bayan an jiƙa a cikin ruwan hydrofluoric acid tare da ƙaramin taro na kashi 40% na tsawon awanni 24, ƙimar asarar ingancin saman ba za ta wuce 0.01% ba; Jiƙa a cikin aqua regia (rabo na yawan hydrochloric acid zuwa nitric acid 3:1) na tsawon awanni 12, kuma babu wata alama ta tsatsa a saman. Tsarin kera semiconductor ya ƙunshi nau'ikan hanyoyin tsaftacewa da goge sinadarai iri-iri, kuma kyakkyawan juriyar tsatsa na tushe zai iya tabbatar da cewa amfani da shi na dogon lokaci a cikin yanayin sinadarai ba ya lalacewa, kuma ana kiyaye daidaito da amincin tsarin.
Hana gurɓatawa: Kayan tushe yana da ƙarancin shan gurɓatattun abubuwa a cikin yanayin masana'antar semiconductor, kamar iskar gas ta halitta, ions na ƙarfe, da sauransu. Idan aka sanya shi a cikin muhalli mai ɗauke da 10 PPM na iskar gas ta halitta (misali, benzene, toluene) da 1ppm na ions na ƙarfe (misali, ions na jan ƙarfe, ions na ƙarfe) na tsawon awanni 72, canjin aiki da shaƙar gurɓatattun abubuwa a saman tushe ke haifarwa ba shi da yawa. Wannan yana hana gurɓatattun abubuwa ƙaura daga saman tushe zuwa yankin ƙera guntu kuma yana shafar ingancin guntu.