A cikin aiwatar da masana'antar semiconductor motsi zuwa nanoscale masana'antu tafiyar matakai, wafer yankan, a matsayin key mahada a guntu masana'antu, yana da musamman m bukatun ga kayan aiki kwanciyar hankali. Tushen granite, tare da ƙwaƙƙwaran juriyar rawar jiki da kwanciyar hankali na thermal, ya zama babban ɓangaren kayan aikin yankan wafer, yana ba da garanti mai dogaro don cimma daidaito mai inganci da ingantaccen sarrafa wafer. ;
Babban damping da halayen anti-vibration: Kare daidaiton yankan matakin nano
Lokacin da kayan aikin yankan wafer ke aiki, saurin juyawa mai sauri na spindle, haɓaka mai saurin girgiza kayan aikin yankan, da girgizar muhalli da kayan aikin da ke kewaye da su ke haifar da tasirin gaske akan daidaitaccen yanke. Ayyukan damping na sansanonin ƙarfe na gargajiya yana da iyakancewa, yana sa yana da wahala a hanzarta rage girgiza, wanda ke haifar da jita-jita-mataki-mataki na kayan aikin yanke kai tsaye kuma yana haifar da lahani kai tsaye kamar guntun gefuna da fasa a kan wafers. Babban halayen damping na granite tushe sun magance wannan matsala ta asali. ;
Lu'ulu'u na ma'adinai na ciki na granite suna kusa da juna, suna samar da tsarin lalata makamashi na halitta. Lokacin da aka watsar da girgizar zuwa tushe, ƙananan ƙananan ƙirarsa na iya canza ƙarfin rawar jiki da sauri zuwa makamashin thermal, cimma ingantaccen girgizar girgiza. Bayanan gwaji sun nuna cewa a ƙarƙashin yanayin girgiza iri ɗaya, ginin granite zai iya rage girman girgizar da fiye da 90% a cikin daƙiƙa 0.5, yayin da tushe na ƙarfe yana buƙatar 3 zuwa 5 seconds. Wannan fitaccen aikin damping yana tabbatar da cewa kayan aikin yankan ya kasance barga yayin aikin yankan nanoscale, yana ba da garanti mai santsi na yankan wafer da kuma rage ƙimar chipping yadda ya kamata. Misali, a cikin tsarin yankan wafer na 5nm, kayan aiki tare da tushe na granite na iya sarrafa girman chipping a cikin 10μm, wanda ya wuce 40% sama da na kayan aiki tare da tushe na ƙarfe. ;
Ƙarƙashin ƙaƙƙarfan ƙayyadaddun ƙayyadaddun ƙayyadaddun yanayin zafi: Mai juriya ga tasirin sauyin zafin jiki
A lokacin aikin yankan wafer, zafi da ke haifar da gogayya na kayan aikin yankan, daɗaɗɗen zafi daga aiki na dogon lokaci na kayan aiki, da canje-canje a yanayin yanayin yanayin bitar na iya haifar da nakasar thermal na kayan aikin. A coefficient na thermal fadada na karfe kayan ne in mun gwada da high (kimanin 12×10⁻⁶/℃). Lokacin da zafin jiki ya canza ta 5 ℃, ginin ƙarfe mai tsayin mita 1 na iya fuskantar nakasu na 60μm, yana haifar da yanke matsayin don matsawa kuma yana tasiri sosai ga daidaiton yanke. ;
Matsakaicin haɓakar haɓakar thermal na tushen granite shine kawai (4-8) × 10⁻⁶/℃, wanda bai wuce kashi ɗaya bisa uku na kayan ƙarfe ba. Ƙarƙashin canjin yanayin zafi guda ɗaya, ana iya kusan yin watsi da canjin girman sa. Aunawa bayanai na wani semiconductor masana'antu masana'antu nuna cewa a lokacin 8-hour ci gaba da high-intensity wafer yankan aiki, a lokacin da yanayi zafin jiki canzawa da 10 ℃, da yankan matsayi diyya na kayan aiki tare da wani dutse tushe ne kasa da 20μm, yayin da na kayan aiki tare da karfe tushe ya wuce 60μm. Wannan ingantaccen aikin thermal yana tabbatar da cewa matsayin dangi tsakanin kayan aikin yanke da wafer ya kasance daidai a kowane lokaci. Ko da a ƙarƙashin aiki na ci gaba na dogon lokaci ko canje-canje masu tsauri a cikin zafin muhalli, ana iya kiyaye daidaiton yanke daidaito. ;
Rigidity da juriya: Tabbatar da aikin kwanciyar hankali na dogon lokaci na kayan aiki
Bugu da ƙari ga fa'idodin juriya na girgizawa da kwanciyar hankali na thermal, babban ƙarfin ƙarfi da juriya na tushe na granite yana ƙara haɓaka amincin kayan yankan wafer. Granite yana da taurin 6 zuwa 7 akan sikelin Mohs da ƙarfin matsawa wanda ya wuce 120MPa. Zai iya tsayayya da babban matsin lamba da tasiri mai tasiri yayin aikin yankewa kuma ba shi da sauƙi ga lalacewa. A halin yanzu, tsarinsa mai yawa yana ba shi kyakkyawan juriya na lalacewa. Ko da a lokacin ayyukan yankan akai-akai, farfajiyar tushe ba ta da sauƙi don sawa, tabbatar da cewa kayan aiki suna kula da aiki mai mahimmanci na dogon lokaci. ;
A cikin aikace-aikacen aikace-aikacen, yawancin masana'antun masana'antar wafer sun inganta yawan amfanin ƙasa da ingantaccen samarwa ta hanyar ɗaukar kayan yankan tare da sansanonin granite. Bayanai daga babban tushe na duniya sun nuna cewa bayan gabatar da kayan aikin granite, yawan amfanin gona na wafer ya karu daga 88% zuwa sama da 95%, an tsawaita sake zagayowar kayan aikin sau uku, yadda ya kamata rage farashin samarwa da haɓaka gasa kasuwa. ;
A ƙarshe, tushen granite, tare da kyakkyawan juriya na rawar jiki, kwanciyar hankali na thermal, tsayin daka mai ƙarfi da juriya, yana ba da garantin ingantaccen aiki don kayan yankan wafer. Kamar yadda fasahar semiconductor ta ci gaba zuwa mafi girman daidaito, sansanonin granite za su taka rawar gani sosai a fagen masana'antar wafer, haɓaka ci gaba da haɓaka sabbin masana'antar semiconductor.
Lokacin aikawa: Mayu-20-2025