Saurin ci gaban fasahar Augmented Reality (AR) da Virtual Reality (VR) yana sanya buƙatu marasa misaltuwa ga kayan gani. A zuciyar waɗannan tsarin na zamani akwai wani muhimmin abu: madaidaicin wafer ɗin gilashi. Yayin da na'urori suka zama sirara, haske, da kuma nutsewa, ƙayyadaddun abubuwan da ke cikin gilashin da ke tallafa musu suna ƙara zama masu tsauri.
Ga masu tsara tsarin gani da masana'antun gani, fahimtar waɗannan bambance-bambancen fasaha ba wai kawai game da samo kayan aiki ba ne - yana game da ba da damar samar da sabbin na'urori masu auna sararin samaniya. A ZHHIMG, muna haɗa gibin da ke tsakanin kimiyyar kayan aiki da aikin gani. Ga mahimman bayanai da kuke buƙatar sani lokacin zaɓar wafers na gilashi don aikace-aikacen AR/VR.
Abubuwan Substrate da Fihirisar Haske
Zaɓin kayan gilashi yana nuna hanyar gani da kuma siffar na'urar ƙarshe.
- Gilashin Mai Rage Haske Mai Kyau (n > 1.8): Ga nunin AR da aka yi da jagorar raƙuman ruwa, ana buƙatar haɗa haske yadda ya kamata kuma a jagorance shi ta hanyar cikakken tunani na ciki. Gilashin mai ƙarfi yana ba da damar ƙananan injunan gani masu haske da faffadan fannoni na gani (FOV).
- Silica Mai Haɗawa: An fi so don sarrafa laser na UV da aikace-aikacen da ke buƙatar kwanciyar hankali mai tsanani. Ƙarancin haɓakar zafi yana tabbatar da cewa aikin gani yana ci gaba da kasancewa daidai ko da a ƙarƙashin haske mai ƙarfi.
- Daidaitawar Zafi: A cikin na'urorin gani na matakin wafer, sau da yawa ana buƙatar haɗa gilashin da na'urori masu auna silikon ko nuni. Zaɓin abun da ke cikin gilashi tare da ma'aunin faɗaɗa zafi wanda ya dace da silicon (kimanin 2.6 × 10⁻⁶/K) yana da mahimmanci don hana warping ko delamination yayin zagayowar zafin jiki.
Juriyar Girma da Ingancin Fuskar
A fannin na'urorin hangen nesa na matakin wafer, ana auna daidaito a cikin microns da nanometers. Bayanan gilashin kasuwanci na yau da kullun ba su aiki a nan.
- Diamita da Kauri: Tsarin da aka saba amfani da shi ya haɗa da wafers na 200mm da 300mm, tare da kauri tsakanin 0.3mm zuwa 5mm.
- Juriyar Kauri: Muna kiyaye juriya mai ƙarfi, yawanci ± 5µm, don tabbatar da daidaito a fadin wafer ɗin.
- Bambancin Kauri Gabaɗaya (TTV): TTV na <5µm yana da mahimmanci don kiyaye mai da hankali da kuma hana kurakurai a cikin kayan haɗin ido.
- Faɗi: Domin hana gurɓatar hoto, dole ne a sarrafa baka da karkacewar zuwa <20µm da <5µm bi da bi.
Ƙarshen Surface da Taushi
Ingancin saman gilashin yana shafar watsa haske da watsawa kai tsaye.
- Taushi (Ra): Don kayan aikin gani na AR VR masu aiki sosai, muna cimma ƙimar taushi a saman Ra <1nm. Wannan santsi na kusan-atomic yana rage watsa haske da hazo, yana tabbatar da babban bambanci da haske.
- Ingancin Sama: Bisa ga ƙa'idodin MIL-PRF-13830B, yawanci muna ba da gilashi mai ƙimar haƙa 40-20 ko fiye. A cikin aikace-aikacen da ke da alaƙa da lahani kamar lithography ko laser optics, har ma da lalacewar ƙasan saman dole ne a kawar da su ta hanyar dabarun gogewa na zamani.
Ci gaba da Sarrafawa da Rufi
Gilashin da ba a sarrafa shi ba shine farkon. Aikin wafer ɗin yana bayyana ne ta hanyar sarrafa shi.
- Goge Gefe Biyu (DSP): Yana da mahimmanci ga aikace-aikacen da ke buƙatar haske mai haske a ɓangarorin biyu, kamar masu raba katako ko gilashin murfin tsarin LiDAR.
- Rufin Hana Haske (AR): Don haɓaka watsa haske (sau da yawa fiye da 98%), ana ajiye murfin AR daidai. Ana amfani da Spectrophotometry don tabbatar da aikin rufi a fadin bakan da ake iya gani (400-700nm) ko takamaiman raƙuman laser (misali, 940nm don fahimtar 3D).
- Yankewa da Siffanta Laser: Don yanayin geometric na musamman ko na gani mara zagaye, yanke laser yana ba da gefuna masu tsabta tare da ƙarancin fashewar ƙananan ƙwayoyin cuta, yana rage buƙatar niƙa mai yawa a gefen.
Kwatanta Nau'ikan Gilashi don AR/VR
| Sigogi | Gilashin Mai Girma | Silica Mai Haɗawa | Borofloat / Alkali-Aluminosilicate |
|---|---|---|---|
| Fihirisar Haske (nd) | > 1.80 | ~ 1.46 | ~ 1.52 |
| Faɗaɗawar Zafi | Matsakaici | Matsanancin Ƙasa | Ƙasa |
| Babban Aikace-aikacen | Masu Haɗa Jagorar Waveguide | Na'urorin gani na UV / abin rufe fuska | Gilashin Murfi / Na'urori masu auna sigina |
| Babban Amfani | Rage Ragewa | Kwanciyar Hankali ta Zafi | Farashi / Dorewa |
Tsarin Aiki da Tabbatar da Inganci
Tabbatar da waɗannan ƙayyadaddun bayanai yana buƙatar ilimin tsarin aiki na zamani. Muna amfani da interferometry don taswirar lanƙwasa da TTV a duk faɗin saman wafer. Don tabbatar da rufin, spectrophotometers suna auna watsawa da tunani a kusurwoyi daban-daban na faruwar abu (AOI).
Ko kuna ƙirƙirar na'urori masu auna 3D don wayoyin komai da ruwanka ko kuma masu amfani da na'urori masu auna 3D masu rikitarwa don gilashin AR, ingancin substrate ɗinku yana ƙayyade iyakar aikin tsarin ku.
Yi aiki tare da ZHHIMG
A ZHHIMG, mun ƙware wajen kera wafers na gilashi masu daidaito waɗanda suka dace da buƙatun masana'antar gani. Daga zaɓin kayan aiki zuwa rufin ƙarshe, muna samar da mafita daga ƙarshe zuwa ƙarshe waɗanda ke taimaka muku wajen cimma iyakokin abin da zai yiwu a cikin AR da VR.
A shirye don inganta ƙirar gani?
Lokacin Saƙo: Afrilu-07-2026